Device for test milling an ore sample

ABSTRACT

A device for generating milling measurement data at an output includes a support structure. A measurement station is supported by the support structure for measuring an attribute of milled material collected thereon and outputting a measurement of the attribute to the output. A mill is supported by the support structure above the measurement station for, while engaged, performing a continuous milling action on a feed material, and continuously or regularly depositing milled material onto the measurement station wherein the measurement station can measure the milled material without interrupting the milling action

REFERENCE TO CO-PENDING APPLICATION

The present application is a continuation of and claims priority to U.S.application Ser. No. 16/832,919, filed on Mar. 27, 2020, entitled DEVICEFOR TEST MILLING AN ORE SAMPLE, which claims priority to U.S.Provisional application 62/824,378, filed Mar. 27, 2019, entitled DEVICEFOR TEST MILLING AN ORE SAMPLE, and the entire disclosure of both priorapplications is incorporated herein by reference.

FIELD OF THE DISCLOSURE

The present disclosure relates to SPI testing procedures.

BACKGROUND

The Standard SAG (Semi-Autogenous Grinding) Power Index (SPI) procedureinvolves milling a prepared feed sample in the SPI mill for a set time,removing, screening, weighing an oversized fraction and returning theentire sample to the mill in several iterations (hereinafter referred toas “reset iterations.”)

The Standard SAG Power Index (SPI) Test, developed in 1991, is now aStandard Metallurgical Test in the mining industry. It is used toestimate the hardness variability of an ore body, in grinding circuitdesign, optimization and production forecasting.

The SPI time is used to estimate the SAG specific energy of a feedsample or block using the relationship, under formula:

kWh/t=K[SPI/√(T ₈₀)]^(n) A   (Equation 1)

where:

K and n are constants,

T₈₀ is the transfer size of the SAG product;

A is a correction factor for the feed size, pebble crushing andcirculating load; and

SPI is SAG Power Index value measured in minutes.

The SPI Test is performed in a laboratory scale SPI mill with a preparedfeed sample weighing 2 kg and in a condition in which 80% of the feedsample passes through a ½ inch (12.7 mm) mesh screen. The objective ofthe Standard SPI Test is to estimate the time it takes to grind the feedsample to a target condition in which 80% of the feed sample passesthrough a 1.7 mm mesh screen. The feed sample is milled for a successivenumber of repeated set time intervals. After each time interval, the SPImill must be shut down, and the sample entirely removed, screened,weighed and then the entire sample must be returned to the SPI mill torepeat the milling step for the next time interval. This is repeateduntil the target condition is reached. This procedure, especially oncompetent (hard) ores, is time consuming, is labour intensive, resultsin a limited number of data points, and introduces a number of sourcesof error in the management of the feed sample arising from the handlingof the feed sample and the SPI mill throughout the SPI test. Forinstance, there is a risk that not all sample material is removed fromthe SPI mill, leading to varying amounts of unscreened residue remainingin the processing chamber at each reset iteration, or an error in not(or incorrectly) resetting for the next iteration.

SUMMARY

In an aspect, there is provided a device for generating millingmeasurement data at an output, comprising a support structure. Ameasurement station may be supported by the support structure formeasuring an attribute of milled material collected thereon andoutputting a measurement of the attribute to the output. A mill may besupported by the support structure above the measurement station for,while engaged, performing a milling action on a feed material, anddepositing milled material onto the measurement station wherein themeasurement station can measure the milled material without interruptingthe milling action.

In some example embodiments, the mill may be configured to continuously,regularly, irregularly or intermittently perform the milling action.

In some example embodiments, the mill may be configured to continuously,regularly, irregularly or intermittently deposit milled material ontothe measurement station.

In some example embodiments, the measurement station may be configuredto continuously regularly, irregularly or intermittently measure theattribute, and wherein the attribute may be a weight of the milledmaterial collected on the measurement station. Other attributes may alsobe monitored in addition to or in place of a weight attribute, dependingon a desired test.

In some example embodiments, the measurement station may comprise aweighing structure to weigh the milled material collected thereon.

In some example embodiments, the measurement station may be configuredto continuously regularly, irregularly or intermittently output ameasurement of the attribute.

In some example embodiments, the output may be selected from at leastone of a display, a scale or an input to a computer system.

In some example embodiments, the mill may comprise a processing chamberfor holding the feed material while it performs the milling actionthereon.

In some example embodiments, the processing chamber may comprise aplurality of test milling balls.

In some example embodiments, the processing chamber may comprise aninlet aperture for accepting the feed material.

In some example embodiments, the processing chamber may comprise anoutlet aperture for depositing the milled material onto the measurementstation,

In some example embodiments, the input aperture and the outlet aperturemay be the same.

Some example embodiments may further comprise a mesh cover to cover theoutlet aperture, which may have openings of an opening size therein todeposit the milled material that is of a size less than the opening sizeonto the measurement station.

In some example embodiments, the mesh cover may be removable.

In some example embodiments, the opening size may correspond to adesignated mesh classification according to a designed test procedure.

In some example embodiments, the mesh cover may be supported by aperipheral frame. The peripheral frame may have a first mountingportion. The first mounting portion may be configured to engage acorresponding second mounting portion secured to the processing chamber.A gasket may be placed between the peripheral frame and the processingchamber structure adjacent the opening to reduce test material fromescaping the processing chamber and bypassing the mesh cover during amilling step.

In some example embodiments, the peripheral frame may comprise a firstflange portion and the processing chamber may comprise a second flangeportion. The first and second mounting portions may comprise areleasable fastener for securing the first flange portion to the secondflange portion.

In some example embodiments, the support structure may be movablebetween a loading position in which the mill may be configured to acceptintroduction of the feed material therein through the input aperture andan operative position in which the mill may be configured tocontinuously mill the feed material introduced while in the loadingposition and output the milled material through the outlet aperture ontothe measurement station.

Some example embodiments may further comprise a drive unit for rotatingthe processing chamber about a drive axis in the operative position.

In some example embodiments, the processing chamber may be orientedwhile in the loading position such that the input aperture is orientedsubstantially upward. Additionally, or alternatively, the processingchamber may be oriented in the operative position such that the outletaperture is oriented substantially downward.

In some example embodiments, the processing chamber may be orientedwhile in the loading position such that the drive axis is inclinedupward and in the operative position such that the drive axis issubstantially horizontal.

Some example embodiments may further comprise a drive unit for drivingthe processing chamber about a drive axis.

Some example embodiments may further comprise a controller incommunication with the measurement station, the controller comprising,or configured to communicate with, a processor and a non-transientmemory for storing instructions that, when executed by the processor,cause the control unit to perform a test procedure, wherein the testprocedure may comprise:

-   -   initiating the test procedure to measure the attribute of the        milled material deposited on the measurement station and        outputting the measurement of the milled material to the output;        and    -   terminating the test procedure when a condition is satisfied.

In some example embodiments, the controller may be configured to enablethe drive unit; and to terminate the test procedure by disabling thedrive unit when the condition is satisfied.

In some example embodiments, the condition may be satisfied by themeasurement reaching a threshold value.

In some example embodiments, the threshold value may be a proportion ofan attribute of the feed material.

In another aspect, there is provided a device for generating millingmeasurement data at an output, comprising: a mill having a processingchamber, the mill configured to perform, while engaged, a milling actionon a feed material in the processing chamber and removing a screenedundersized milled material from the processing chamber. A measurementstation may be configured to measure an attribute associated with thescreened undersized milled material and to output a measurement of theattribute to the output without interrupting the milling action.

In some example embodiments, the mill may be configured to continuously,regularly, irregularly or intermittently perform the milling action.

In some example embodiments, the mill may be configured to continuously,regularly, irregularly or intermittently remove the screened undersizedmilled material from the processing chamber.

In some example embodiments, the measurement station may be configuredto detect a change in the attribute by a change in a characteristic ofthe processing chamber or of milled material therein.

In some example embodiments, the characteristic may be a weight of theprocessing chamber or the screened undersized milled material removedtherefrom.

In some example embodiments, the measurement station may be a weighingstation configured to collect screened undersized milled materialremoved from the processing chamber.

BRIEF DESCRIPTION OF THE FIGURES

Several example embodiments of the present disclosure will be provided,by way of examples only, with reference to the appended drawings,wherein:

FIGS. 1 and 2 are perspective views of a device according to an exampleembodiment;

FIG. 3 is a side view of the device of FIG. 1 in a loading position;

FIG. 4 is a side view of the device of FIG. 1 in an operative position;

FIG. 5 is a schematic view of the device of FIG. 1;

FIG. 6 is a schematic view of a graph of SPI values versus powerconsumption for an SPI Test;

FIG. 7 is a schematic diagram of a method utilizing an exampleembodiment;

FIGS. 8a and 8b are respective plots of outputs of a SPI Test, and aCSPI Test utilizing an example embodiment;

FIG. 9 is a plot of time versus time for duplicate methods utilizing anexample embodiment;

FIGS. 10 to 12 are comparative time-time plots for a method utilizing anexample embodiment; and

FIG. 13 is a comparative plot of the time-time plots of FIGS. 9 to 11;

FIG. 14 is a comparative plot of time-time plots for yielding a genericequation for a test sample; and

FIGS. 15, 16, 17, and 18 are time- percent mass plots for use indetermining a kinetic constant.

DETAILED DESCRIPTION

It should be understood that the invention is not limited in itsapplication to the details of construction and the arrangement ofcomponents set forth in the following description or illustrated in thedrawings. The invention is capable of other embodiments and of beingpracticed or of being carried out in various ways. Also, it is to beunderstood that the phraseology and terminology used herein is for thepurpose of description and should not be regarded as limiting. The useof “including,” “comprising,” or “having” and variations thereof hereinis meant to encompass the items listed thereafter and equivalentsthereof as well as additional items. Unless limited otherwise, the terms“connected,” “coupled,” and “mounted,” and variations thereof herein areused broadly and encompass direct and indirect connections, couplings,and mountings. In addition, the terms “connected” and “coupled” andvariations thereof are not restricted to physical, mechanical or otherconnections or couplings. The terms upper, lower, and vertical areintended for operative context only and are not necessarily intended tolimit the invention only to those configurations or orientations. In anyinstance in which the disclosure refers to a single instance of anelement, example embodiments may include a multiple of such elements.The term “at least one” in reference to any element is not intended toforce an interpretation on any other reference elsewhere in thedisclosure to a single instance of an element to mean only one suchinstance of the element. Furthermore, and as described in subsequentparagraphs, the specific mechanical and/or other configurationsillustrated in the drawings are intended to exemplify embodiments of theinvention. However, other alternative mechanical and/or otherconfigurations are possible which are considered to be within theteachings of the instant disclosure. Furthermore, any one element,feature, structure, function, of any aspect and/or example embodimentdescribed in the present disclosure including the figures, clausesand/or claims herein, may itself be claimed on its own or be combinedwith any one or more elements, features, structures, functions, and/orsteps from the same or any other aspects and/or example embodimentsdescribed in the present disclosure including the figures, clausesand/and claims herein.

The term “undersized fraction” means the fraction of a test sample offeed material that is smaller in particle size than the openings of amesh structure. Thus, when a test sample is milled or otherwiseprocessed and delivered to a mesh screen of a designated mesh screensize or number, the undersized fraction passing through the screen maybe classified by the designated screen size or number, while the“oversized” fraction does not pass through.

As will be described, example devices and methods herein may beconfigured to continuously remove an undersized fraction of a testsample as the test sample is processed and achieved by placing a meshstructure, or screen, on an SPI mill and by measuring the undersizedfraction discharged continuously to a weighed sample collectionlocation, until a designated threshold, or final set point, is reached.In some example embodiments, the processed sample may be collected andmeasured at regular intervals while the processing of the samplecontinues. This may be referred to as a Continuous SPI (CSPI) Testoutput which may be associated with the SAG Power Index to provide acalibrated CSPI Index Value. In other example devices and methods, theremoval of the undersized fraction, the collection and/or themeasurement of the sample may in some instances occur regularly,irregularly or intermittently while the sample is processed.

Referring to FIGS. 1 to 5, there is provided a device 10 for generatingmilling measurement data at an output 12. The device 10 comprises asupport structure 14 and a measurement station 16 supported by thesupport structure 14 for measuring an attribute of a test sample milledmaterial collected thereon, and outputting a measurement of theattribute to the output.

A mill structure 18 is supported by the support structure 14 above themeasurement station 16 for, while engaged, continuously performing amilling action on a feed material, such as in this example embodiment atest sample, and depositing an undersized fraction of the test sampleonto the measurement station 16 where it can measure the attribute ofthe undersized fraction without interrupting the milling operation.

The measurement station 16 is, in this example embodiment, a weighingstructure which is configured to measure the attribute. The measurementstation 16 may be configured to output a measurement of the attribute.The measurement and or the output of the attribute may occur on acontinuous or regular basis, according to a designated rate, while themill structure 18 is operating. The output may be selected from at leastone of a display, a scale or an input to a computer system. Otherattributes may also be monitored in addition to or in place of a weightattribute, depending on a desired test.

The mill structure 18 comprises a processing chamber 22 for holding thetest sample while it performs a milling action thereon. Located in theprocessing chamber is a plurality of test milling balls 24 (FIG. 1).

The processing chamber has an opening 26 which serves both as an inletaperture 28 (FIG. 3) for accepting the test material and an outletaperture 30 (FIG. 4) for depositing the undersized fraction 32 onto themeasurement station 16 (for example to be deposited into a receptacle 34thereon). Thus, the input aperture 28 and the outlet aperture 30 areprovided by the opening 26 in this instance, while in other exampleembodiments, the inlet and outlet apertures may be different.

The opening 26 is configured to accept a mesh cover 38 thereon, havingopenings of an opening size therein to deposit the undersized fraction,that is of a size less than the opening size onto the measurementstation 16. The mesh cover 38 is removable and the opening sizecorresponds to a designated mesh classification according to a designedtest procedure.

Referring to FIG. 2, the mesh cover 38 is supported by a peripheralframe 40 having a first mounting portion 42 to engage a correspondingsecond mounting portion 44 secured to the processing chamber 22. Theperipheral frame 40 comprises a first flange portion 46 and theprocessing chamber comprises a second flange portion 48 wherein thefirst and second mounting portions 46 and 48 comprise a releasablefastener 50 for securing the first flange portion 46 to the secondflange portion 48. A gasket, such as rubber ring (not shown) may beplaced between the peripheral frame 40 and the processing chamberstructure adjacent the opening to reduce, if not eliminate, testmaterial from escaping the processing chamber 22 and bypassing the meshcover 38 during a milling step.

Thus, the support structure 14 is movable between a loading position, asshown in FIG. 3, in which the mill structure 18 is configured to acceptintroduction of the test sample therein through the input aperture 28,and an operative position shown in FIG. 4, in which the mill structure18 is configured to continuously mill the test sample and output theundersized fraction through the outlet aperture 30 into the receptacle34 of the measurement station 16.

Referring to FIG. 3, the processing chamber 22 may be oriented, while inthe loading position, such that the inlet aperture 28 is orientedsubstantially upward, and may be oriented in the operative position suchthat the outlet aperture 30 is oriented substantially downwardlyrelative to the loading position and with the outlet aperture in aposition to permit the undersized fraction to pass through the openingsin the mesh cover by the action of the milling balls against the testsample during operation of the mill structure 18.

A drive structure is provided at 52 rotating the processing chamber 22about a drive axis 54 (FIG. 4) while in the operative position. Thedrive structure includes a shaft 60 defining the drive axis 54, which issupported by a number of bearings 62 a, with the processing chamber 2mounted on the right hand end, as shown in FIGS. 2 and 3, and atransmission section 64, which in turn is operatively coupled to motor66.

Referring to FIG. 5, the device 10 further comprises a controller 56which is configured to be in communication with the drive structure 52and the measurement station 16. The controller comprises or communicateswith a processor 56 a and a non-transient memory 56 b for storinginstructions that, when executed by the processor 56 a, cause thecontroller 56 to perform a test procedure, by:

-   -   a) initiating the test procedure by engaging the drive structure        52 while in the operative position, so that the mill structure        18 mills the test sample without interruption;    -   b) measuring the attribute of the undersized fraction deposited        on the measurement station 16 and outputting the measurement to        the output 12; and    -   c) terminating the test procedure by disengaging the drive        structure 52 when a designated condition is satisfied.

In some example embodiments, the controller 56 may or may not controlthe onset operation of the drive structure 5. For example, thecontroller 56 may rather be configured to be enabled in response toonset of operation of the drive structure 52.

In some example embodiments, the designated condition may be satisfiedby the measurement reaching a threshold value, such as a designatedproportion of an attribute of the test sample. In this example, theattribute may be weight of the undersized fraction expressed as apercentage of the weight of the test sample. Other designated conditionsmay include weight of the remaining oversized fraction in the processingchamber 22, as a percentage of the test sample.

In some example embodiments, the measurement station 16 may beconfigured to detect a change in weight of the processing chamber 22, asopposed to an accumulation of weight in a receptacle 34. For instance,the measurement station 16 may be configured to be located between thesupport station 14 and the processing chamber 22, to register a changein weight of the processing chamber 22, while allowing for power to bedelivered to the processing chamber 22. While the processing chamber 22is rotated, other example embodiments may enable motion of theprocessing chamber by vibration, or lateral reciprocal motion, forinstance.

Thus, the device 10 may be configured in a number of ways. For instance,the processing chamber 22 may be configured to be used with meshes ofdifferent mesh classifications, depending on the test procedure, bychanging the mesh cover 38, or the mesh supported by the mesh cover 38.As in the example embodiments discussed below, the mesh may be a 12-inchdiameter Tyler™ 10 mesh (1.7 mm), though other mesh configurations mayalso be applicable such as 6 mesh (3.35 mm) or 8 mesh (2.36 mm).

In some example embodiments, the measurement station 16 may include alaboratory balance, with a receptacle 34 in the form of a test samplepan, aligned under the outlet aperture 30 to capture the undersizedfraction.

In some example embodiments, the controller 56 may be provided by orinclude a general purpose computer communicating with an output on thelaboratory balance by way of a wired or wireless computer peripheralinterface.

A cover structure shown schematically at 58 in FIG. 4 may be placed overthe measurement station 16 and the processing chamber 22 to effectivelyenclose the mill structure 18 to control dusting that may occur during atest procedure, or to prevent contamination of the accumulatedundersized fraction.

An example testing procedure is presented in FIG. 7. A designated sampleof feed material for testing may be prepared at step 70 by selecting a 2kg portion thereof to form the test sample, which may then be placed inthe processing chamber 22, when oriented in the loading position. Themesh cover 34 may then be secured (at step 72) over the processingchamber 22 after securing the fasteners 50 between the first and secondflange portions 46, 48. Alternatively, the designated sample may bepartitioned whereby the oversized (plus 10 Tyler) fraction is placed inthe processing chamber (mill) and any undersized (minus 10 Tyler)fraction that may already be present in the designated sample is addedto the balance at the start of the milling process, to reduce possiblebuffering effects, as discussed below, that may arise as a result of theundersized fraction being present in the processing chamber at the onsetof the procedure.

The device 10 may then be moved with the processing chamber in theoperative position, with the receptacle 34 placed in position on themeasurement station 16. The cover structure 58 may then be placed overthe processing chamber 22, the receptacle 34 and the measurement station16. Thus, device 10 may be configured to that, during operation, theoversized fraction (ie larger than the 10 mesh) remains in theprocessing chamber 22 (at step 74) while the undersized fraction(smaller than the 10 mesh) progresses to the receptacle 34 (at step 76).

With the device 10 so prepared, the drive structure 52 may then beactivated at step 78, and the controller 56 (in the form of a computerin this example) may then be enabled (at step 80) to initiate the testprocedure and monitor the designated test condition, including enablingthe measurement station 16 to generate weight measurements overpredetermined time periods (at step 82) and to dispatch the data to thecomputer (at steps 84, 86, 88), to yield an output, such as an excellisting or the line on a screen or print out (at step 90) and, finallyto terminate the test procedure when the designated test condition ismet.

EXAMPLES

Feed material was stage crushed, as typically occurs at the mining sitein a first or early stage ore processing step, to a condition in which100% of the feed material being sized below ¾ inches (19.0 mm) (referredto as “minus ¾ inch”) and with 20% being sized plus ½ inches (12.5 mm)(referred to as “plus ½ inch”).

Duplicate samples were prepared from three different ore bodies withhardness ranging from an SPI time of 4 minutes (soft) to 295 minutes(hard). For each pair of samples selected, one used in a CSPI Test usingan example embodiment of the device 10, and the other used in an SPITest, with the data plotted on calibration curves.

For each ore body, a 2 kg. test sample, 100% minus ¾ inch, having aproportion of 20% plus ½ inch, was screened. The “plus” 0.067 inch (1.7mm) material (that is material having a particle size in excess of 1.7mm) was placed in the processing chamber 22 together with the millingballs 24. The mesh cover 38 was provided with a Tyler™ 10 mesh screen(available from wstyler.com) and positioned and secured in place in theopening 26. The processing chamber was then moved to the operativeposition and the measurement station 16, receptacle 34 (with theremaining minus 0.067 inch (1.7 mm) feed) and the cover structure 58were also placed in position. The controller 56 was programmed tocollect information every second and stop the mill structure 18 at a setpoint when the discharged undersized fraction reached around 1600 g(˜80% of the test sample). The “minus” 0.067 inch (1.7 mm) undersizedfraction material was obtained after milling and thereafter collectedfrom the screen in the receptacle 34. These steps were repeated for anumber of test samples.

While the mesh cover 38 did not show significant damage for the firstfifty tests performed on the mill structure 18, the mesh cover 38 waschanged to ensure consistent passage sizes to reduce a possibility oflarger un-sized particles passing through the mesh cover 38.

FIGS. 8a and 8b present an example of results of acquired data collectedfor a standard SPI Test (FIG. 8a ) and a CSPI Test procedure (on a firstore body from South America as shown in table 1), using an example ofthe device 10 (FIG. 8b ). In the case of the CSPI Test, the accumulatingweight of the undersized fraction was repeatedly measured at one secondincrements over the test procedure operating period. FIG. 8b shows arelatively smooth and continuous graph. FIG. 8a , in contrast, showsfour data points after four separate reset iterations.

In another example, pairs of the same samples of the first (SouthAmerica) ore body were carried out on an example of the device 10 todetermine the repeatability, with the results presented in FIG. 9, withy at 0.99x and R² at 0.98. The results estimated a standard error to be1.9, indicating very good operational repeatability.

In another example, an example of the device 10 was used in a CSPI Test,in parallel with an SPI Test, on samples from a second ore body (an ironore deposit), with results shown in FIG. 10 in which the X axis is timeusing the CSPI Test to reach a weight threshold of 80% of the testsample, and the Y axis is the is time using the SPI Test to reach aweight threshold of 80% of the test sample, with y=2.74x−4.48 and R² at0.99. The sample SPI times show a hardness range from 4 minutes to 104minutes, that is to reach the designated threshold of 80 percent passingthrough 10 mesh (1.7 mm), while the CSPI Test shows a hardness rangefrom 3 to 40 minutes. In this case, continuous removal of the undersizedfraction (smaller than 1.7 mm) through the screen reduces (if notprevents) the undersized fraction from buffering the milling balls, asmay occur if the undersized fraction accumulates in the processingchamber to an extent to cause significant quantities of the undersizedfraction to be present between the balls and respective instances of theoversized fraction at the point of impact there between, to reduce theeffectiveness of the impact, and thus reduce a milling functionefficiency, thus causing a resulting reduction of milling rate and anincrease in needed processing time.

FIG. 11 is a plot for samples from of a third ore body, in this case of“hard ore” within the ore body (meaning having a hardness of an SPI timegreater than 150 minutes) in which the hardness, SPI time ranges from 60minutes to 293 minutes with a standard error of 17, with relatively morevariability, with y=3.39x−24.44 and R² at 0.94.

FIG. 12 presents the data for test samples from a third medium harddeposit. The SPI time ranges from 29 minutes to 157 minutes with astandard error of 7.2, with y=3.04x−11.57 and R² at 0.96.

All test data from seventy eight pairs of test samples from the first,second and third ore bodies is displayed in FIG. 13, 14 to observe anoverall outcome (when two general equations are possible, and which maybe used to calculate the SPI from the CSPI. The hardness variabilityranges from soft to hard (˜4 minutes to 293 minutes). More useful datamay be obtained by evaluating each ore deposit separately and work withthe grindability of that range. This approach may lead to a betterSPI/CSPI relationship specific to a particular deposit.

The 12 inch diameter Tyler™ 10 mesh was found to be strong with littlevariations but was changed three times during the investigations toeliminate uncertainties.

The collected data in FIGS. 9, 10, 11, 12 shows that each ore body maypresent a different gradient which may provide greater insight into theprogressing milling process and how it may be optimized. Thisdemonstrates that the CSPI Test may be repeatable and may be calibratedto an accepted test while providing significantly improved granularityin results. This approach may thus yield a parity curve for each minedeposit tested within the range of hardness as representative of thatore body, thus providing the basis for establishing values for each ofthe variables for an equation for the ore body.

TABLE 1 SPI Test Std Std Range No. of Identification Linear Equations.Index, Time in min. R² Dev Error min max Samples An Iron Ore Company SpiTime = 2.74 * CSpi Time − 4.48 0.99 24.3 2.8 4 104 19 A Hard Ore MineSpi Time = 3.39 * CSpi Time − 24.44 0.94 73.0 17.0 60 293 15 A SouthAmerican Ore body Spi Time = 3.04 * CSpi Time − 11.57 0.96 36.1 7.2 29157 44 Overall Generic Equation (Linear) Spi Time = 3.12 * CSpi Time −12.03 0.97 51.6 11.6 4 293 78 Generic Equation (Power) Spi Time = 1.37 *{CSpi Time}^(1.19) 0.98 51.6 11.6 4 293 78

Table 1 presents a summary of the surveys of the three ore bodies testedfrom three different locations. Linear equations are presented as thebest fit within each ore deposit and an overall equation, linear andpower, to fit the data from the three deposits.

Comparative data shows that the CSPI test procedure may be used as amodified form of the standard SPI, and may involve fewer steps, arelatively shorter time to complete a test, with reduced manual errorsarising such as with the handling of the feed sample at each resetiteration.

The output data provided by the CSPI Test may thus provide a complementto the Standard SPI Test, with a relatively faster turn-around time onmore competent (hard) ore while saving the time involved in the severalreset iterations, and removing or reducing errors that would otherwisearise with such reset iterations.

The CSPI Test may be orebody specific in some cases where a calibrationcurve is established for the ore body being investigated.

Some example embodiments may thus provide a model of the grindingbehaviour of the ore sample over time. The CSPI test procedure may allowthe grindability to be assessed at a higher frequency (grams per secondthrough the screen) giving rise to comparatively many data points ascompared to the SPI with four (or comparatively few) data points. Thismay allow for the calculation of possible kinetics to assess thegrinding behavior of the sample. (For example, the grinding pattern mayconfirm a rate constant or give rise to a spread of rate constants forthe sample under consideration). Grindabilty, as indicated by one ormore K values, may demonstrate the degree of heterogeneity of the orebody under consideration. The value “K” is a kinetic constant for eachsample which may be incorporated in grinding models to assist inpossible plant designs.

For example, a grinding behaviour of a sample under investigation may beassembled by fitting a rate equation. As seen in FIGS. 15, 16, 17, and18, two models were attempted namely a first order rate equation, and anequation that may relate an average k value to describe a spread of k at90% grind. The first order model describes the actual sample that ismilled after removing the percentage passing the grind size. The modelthat defines a spread of rate constant, k average, may have anassociated factor that describes the spread of the k at a set recoveryof 90%. The grinding behaviour may give an indication of thefriability—heterogeneity of the sample. For example, FIGS. 15 and 16 aretwo samples with a CSPI time of about 16 minutes but exhibit differentgrindability (milling) behaviour. FIG. 15 is closer to a first order,whereas FIG. 16 may be described as having a spread of k values. FIGS.17 and 18 may be considered as having a spread of k values over that ofa first order fit. The spread of the k may define a more heterogeneousore whereas a constant k from the first order fit may define a samplethat is closer to being more homogeneous in its hardness behaviour.Other models may also be considered to describe or characterize the rocksample, and define or specify an ore body under consideration.

The present disclosure may be implemented advantageously on anelectronic device within a computing and communications environment thatmay be used for implementing the devices and methods disclosed herein.

In some example embodiments, the electronic device typically comprises aprocessor, which may be and/or function as the processor 56 a of thecontroller 56, and a memory, which may be and/or function as the memory56 b of the controller 56. In some cases, the electronic device mayfurther comprise any one or more of a bus to connect components of theelectronic device, a network interface, a mass storage device, a videoadapter and/or an input and/or output (I/O) interface.

The electronic device may utilize all, or only a subset of suchcomponents, and levels of integration may vary from device to device.

The electronic device may comprise multiple instances of suchcomponents, such as, by way of non-limiting example, multipleprocessors, memories, transmitters and/or receivers.

The processor may be one or more central processing units (CPUs),including without limitation, either or both of general and specificmicroprocessors, and may further include specialized processors such asa graphics processing unit (GPU), digital signal processor (DSP), orother such processor, including without limitation, dedicated hardwarecircuits for performing a specific functionality.

The processor provides functions by executing instructions, codes,computer programs and/or scripts, which it accesses from the memoryand/or a mass storage device in the form of software and/or firmwareand/or in any combination of hardware, software and/or firmware. Thefunctions may be provided by a single dedicated processor, by a singleshared processor, or by a plurality of individual processors, some ofwhich may be shared or distributed.

The functions provided, including without limitation, functional blockslabelled in the drawings and described herein as “functions”, “blocks”,“modules”, “processors” and/or “controllers”, may be provided throughthe use of dedicated hardware, as well as hardware capable of executingsoftware, but should not be understood to refer exclusively to suchhardware.

Such instructions, codes, computer programs and/or scripts may beimplemented in a high-level procedural or object-oriented programminglanguage, a markup language, in source, object and/or assembly codeand/or machine language. Such code or language may be compiled orinterpreted. In particular, the foregoing description of one or morespecific examples does not limit the present disclosure to anyparticular computer programming language, operating system, systemarchitecture or device architecture.

While the instructions may be discussed in the present disclosure asbeing executed by a processor, in some examples, the instructions may beexecuted serially, simultaneously or in parallel.

The memory may comprise any type of non-transitory volatile and/ornon-volatile system memory, readable by the processor, such as, withoutlimitation, random access memory (RAM), used to store volatile data andperhaps to store instructions, including without limitation, static RAM(SRAM), dynamic RAM (DRAM), synchronous DRAM (SDRAM), read-only memory(ROM), a non-volatile memory device (which typically has a small memorycapacity relative to the memory capacity of mass storage devices), suchas, without limitation, programmable ROM (PROM), erasable PROM (EPROM),electrically erasable PROM (EEPROM), flash memory devices, or anycombination thereof. Access to either both of RAM and/or ROM istypically faster than to mass storage devices. In some examples, thememory may be implemented as and/or comprise one or more buffercircuits, such as, without limitation, a latch or a flip flop. In someexamples, the memory can be supplemented by, or incorporated in, any oneor more of an application-specific integrated circuit (ASIC),field-programmable gate array (FPGA) and/or DSP.

In some example embodiments, the processor may receive instructionsand/or data from RAM and/or ROM.

In some example embodiments, the memory may include more than one typeof memory, such as, by way of non-limiting example, ROM for use atboot-up and DRAM for program and/or data storage for use while executinginstructions. In some example embodiments, the memory may serve as acache or interim storage medium for storing data that otherwise would bestored in and accessed from the mass storage device.

In some example embodiments, the memory may be accessed directly by theprocessor, or indirectly along a bus, a network interface and/or an I/Ointerface.

In some example embodiments, the bus may be any one or more of any typeof several bus architecture, including without limitation, a processorbus, a memory bus or memory controller, a peripheral bus, a video bus, ahard drive controller, and/or an I/O controller.

The network interface may be a wired network interface to connect to anetwork, a wireless network interface, including, without limitation, aradio access network interface for connecting to other devices over aradio link. In some examples, the network interface may take the form ofa network connectivity device, such as a modulator-demodulator (modem),a modem bank, a network card, such as, without limitation, a local areanetwork (LAN) card, such as an ethernet card or a token ring card, awireless LAN (WLAN) card, a radio transceiver card, such as, withoutlimitation, a code division multiple access (CDMA) or global system formobile communications (GSM), third generation (3G), including withoutlimitation, general packet radio service (GPRS), universal mobiletelecommunications system (UMTS), enhanced data rates for GSM evolution(EDGE), CDMA2000, wideband CDMA (W-CDMA), fourth generation (4G),including without limitation, long term evolution (LTE), WiMAX, fifthgeneration (5G) and/or later wireless technology card, a fiberdistributed data interface (FDDI) card, a wireless local area auniversal serial bus (USB) interface card, and/or some other serialinterface card, a wireless interface and/or card, including withoutlimitation, WiFi, Bluetooth, near field communications (NFC) and/oranother well-known network device or interface.

The network interface allows the electronic device to communicate with aremote entity, such as a network such as, without limitation, anInternet or one or more intranets and/or a remote entity connected tosuch a network, by which the processor might receive informationtherefrom and/or output information thereto.

In some example embodiments, the network interface may comprise one ormore transmitter and/or receiver for wireless or otherwise transmittingand/or receiving signals respectively.

In some example embodiments, the network interface may be accesseddirectly by the processor, or indirectly along a bus and/or anothernetwork interface and/or an I/O device.

In some example embodiments, at least one of the measurement station 16and the drive structure 52 may be coupled to the electronic device by atleast one of the bus, network interface and/or the I/O interface.

The mass storage device may comprise any type of non-transitory storagedevice, such as, without limitation, an internal or removable drive,such as, without limitation, a magnetic tape drive, a magnetic card ordisk drive, a hard disk drive, an optical disk drive, including withoutlimitation, a video disk drive, a CD-ROM disk and/or DVD-ROM disk, amagneto-optical disk drive and/or a solid state drive.

The mass storage device may be configured to store instructions, dataand/or other information, and to make such instructions, data and/orother information accessible to the processor. In some exampleembodiments, the mass storage device may be integrated with aheterogeneous memory.

In some example embodiments, the mass storage device may be accesseddirectly by the processor, or indirectly along a bus, a networkinterface and/or an I/O interface.

The mass storage device may generally perform storage tasks compatiblewith higher latency but may provide lesser or no volatility. In someexamples, the mass storage device may be used as an overflow storagedevice if the memory is not large enough to hold all working data.

The video adapter and/or I/O interface provide an interface to couplethe electronic device to an internal and/or external I/O device. By wayof non-limiting example, an I/O device may comprise a display coupled tothe video adapter and/or a printer, a video monitor, liquid crystaldisplay (LCD), light-emitting diode (LED) display, a touch screendisplay, a keyboard, keypad, switch, dial mouse, trackball, trackpad,speaker, headset, headphone, voice recognizer, card reader, paper tapereader, fingerprint, iris and/or facial scanning device, and otherwell-known I/O devices coupled to the I/O interface.

In some example embodiments, the I/O device may be accessed directly bythe processor, or indirectly along a bus, a network interface and/or anI/O interface.

In some example embodiments, the electronic device may be an element ofcommunications network infrastructure.

In some example embodiments, the electronic device may be a device thatconnects to the network infrastructure over a radio interface, such as amobile telephone, smartphone, personal digital assistant (PDA) or otherhandheld device, personal computer (PC), audio-visual (AV) terminal,television, video monitor and other devices that may be classified as auser equipment (UE).

In some example embodiments, the electronic device may be a machine typecommunications (MTC) device (also referred to as a machine-to-machine(M2M) device), or another such device that may be categorized as a UEdespite not providing a direct service to a user.

In some example embodiments, the electronic device may also be referredto as a mobile device, a term intended to reflect devices that connectto a mobile network, regardless of whether the device itself is designedfor, or capable of, mobility.

When the electronic device is a network infrastructure element, theradio access network interface may be omitted for nodes or functionsacting as elements of the PLMN, other than those at the radio edge of anetwork.

When the electronic device is infrastructure at the radio edge of thenetwork, both wired and/or wireless network interfaces may be provided.

When the electronic device is a wirelessly-connected device, the radioaccess network interface may be present and may be supplemented by otherwireless interfaces, such as, without limitation, WiFi, bluetooth and/orNFC network interfaces.

In some example embodiments, the electronic device may be a stand-alonedevice, while in other example embodiments, the electronic device may beresident within a data center. As will be understood by those havingordinary skill in the art, a data centre is a collection of computingresources (typically in the form of services) that can be used as acollective computing and/or storage resource. Within a data centre, aplurality of services can be connected together to provide a computingresource pool upon which virtualized entities can be instantiated. Datacenters can be coupled together to form networks consisting of pooledcomputing and/or storage resources coupled to one or another byconnectivity resources.

The connectivity resources may take the form of physical connectionssuch as ethernet and/or optical communications links, and in someinstances, may include wireless communication channels as well. If twodifferent data centers are coupled by a plurality of differentcommunication channels, the links can be combined tougher using any of anumber of techniques, including without limitation, the formation oflink aggregation groups (LAGs).

It should be understood that any or all of the computing, storage and/orconnectivity resources (along with other resources within the network)may be divided among different sub-networks.

Thus, the electronic device may be, in some example embodiments, aprogrammable processing system suitable for implementing or performingone or more of the apparatus(es) or method(s) of the present disclosure.Those having ordinary skill in the relevant art will appreciate that itis understood that typically, the electronic device will have sufficientprocessing power, memory and/or mass storage resources and/or networkthroughput capability to adequately handle the workload imposed upon itby such apparatus(es) and/or method(s).

The apparatus(es) of the present disclosure may in some exampleembodiments be implemented in a computer program product tangiblyembodied in a machine-readable storage device, including withoutlimitation, the memory and/or mass storage device, for execution by theprocessor and the method(s) and/or action(s) of the present disclosurecan be performed by the processor executing one or more instructions,whether or not in a program thereof, to perform functions of thedisclosure, by operating on input data and/or generating output data.

In some example embodiments, information comprising the instructionsand/or data to be acted upon by the processor, may be received and/oroutputted by the processor in the form of a computer data basebandsignal and/or a signal embodied in a carrier wave. In some exampleembodiments, the information may be exchanged between the electronicdevice and a network.

In some example embodiments, the signal may propagate in or on thesurface of an electrical conductor, in a coaxial cable, in a waveguide,in an optical medium, including without limitation, an optical fiber, orin the air or free space. The information contained in the signal may beordered according to different sequences, as may be desirable for eitherprocessing and/or generating the information, and/or in transmittingand/or receiving the information. The signal, whether baseband orembedded in a carrier wave, or other types of signals currently used orhereafter developed, and referred to herein as the transmission medium,may be generated according to several well-known methods.

Thus, an article of manufacture for use with an apparatus of the presentdisclosure, such as a pre-recorded storage device or othercomputer-readable medium, including program instructions recordedthereon, or a computer data signal carrying computer-readable programinstructions may direct an apparatus of the present disclosure tofacilitate the practice of a method of the present disclosure. It isunderstood that such apparatus(es), articles of manufacture and/orcomputer data signals also come within the scope of the presentdisclosure.

The present disclosure describes what are considered to be practicalexample embodiments. It is recognized, however, that departures may bemade within the scope of the invention according to a person skilled inthe art. Further, the subject matter of the present disclosure supportsand provides sufficient basis for any element, feature, structure,function, and/or step of any aspect, and/or example embodiment describedin the present disclosure including the figures, clauses and/or claimsherein to be claimed alone in an independent claim and be fullysupported herein, or be combined with any other one or more elements,features, structures, functions, and/or steps of any aspect and/orexample embodiment described in the present disclosure including thefigures, clauses and/or claims herein, as basis for an independent ordependent claim herein. With respect to the above description, it is tobe realized that the dimensional relationships for the parts of theinvention, to include variations in size, materials, shape, form,function and manner of operation, assembly and use, are deemed readilyapparent and obvious to one skilled in the art, and all equivalentrelationships to those illustrated in the drawings and described in thespecification are intended to be encompassed by the present invention.

While the present disclosure describes various example embodiments, thedisclosure is not so limited. To the contrary, the disclosure isintended to cover various modifications and equivalent arrangements, aswill be readily appreciated by the person of ordinary skill in the art.

1. A device for generating milling measurement data at an output,comprising: a support structure; a measurement station supported by thesupport structure for measuring an attribute of milled materialcollected thereon and outputting a measurement of the attribute to theoutput; and a mill supported by the support structure above themeasurement station for, while engaged, performing a milling action on afeed material, and depositing milled material onto the measurementstation wherein the measurement station can measure the milled materialwithout interrupting the milling action.